What Is Thermal Interface Material (TIM)?_
Thermal interface material fills microscopic air gaps between a heat-generating chip (GPU/CPU die) and its heat sink or cold plate. TIM dramatically improves thermal conductivity at the interface. In DLC systems, proper TIM application between the GPU die and cold plate is critical — inadequate coverage causes hot spots, thermal throttling, and premature GPU failure.
Technical Details
TIM bridges the microscopic surface roughness between the chip die and the heat sink or cold plate surface. Without TIM, air gaps (which have very low thermal conductivity at ~0.025 W/m·K) would severely impede heat transfer. Common TIM types include thermal paste/grease (silicone or metal-based compounds, 1–12 W/m·K), thermal pads (pre-formed solid pads, 1–6 W/m·K, used where controlled thickness is needed), and liquid metal (gallium-based alloys, 20–80 W/m·K, highest performance but chemically reactive). In GPU deployments, TIM application must be correct: too little TIM leaves air gaps, too much TIM increases bond-line thickness (reducing thermal performance), and uneven application creates hot spots. For DLC systems where cold plates directly contact GPU dies, TIM quality and application directly impact GPU operating temperature and longevity.
How Leviathan Systems Works with Thermal Interface Material (TIM)
Leviathan Systems follows manufacturer specifications for TIM application during GPU installation, ensuring proper coverage and thickness for optimal thermal performance in both air-cooled and liquid-cooled configurations.